8444-21B1-RK-TR
3M
CONN SOCKET PLCC 44POS TIN
В наличност11559 pcs
8444-21B1-RK-TR.pdf
160.0µin (4.06µm)
-40°C ~ 105°C
Surface Mount
Solder
PLCC
Closed Frame
UL94 V-0
Polybutylene Terephthalate (PBT), Glass Filled
0.050' (1.27mm)
Tin
160.0µin (4.06µm)
Tin
8400
44 (4 x 11)
Copper Alloy
0.050' (1.27mm)
Copper Alloy
0.132' (3.35mm)
15mOhm
1 A
8444
Tape & Reel (TR)
RFQ
116-93-308-41-007000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
В наличност29354 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
Elevated, Open Frame
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
116
8 (2 x 4)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
-
3 A
116-93
Tube
RFQ
8468-21B1-RK-TR
3M
CONN SOCKET PLCC 68POS TIN
В наличност17286 pcs
8468-21B1-RK-TR.pdf
160.0µin (4.06µm)
-40°C ~ 105°C
Surface Mount
Solder
PLCC
Closed Frame
UL94 V-0
Polybutylene Terephthalate (PBT), Glass Filled
0.050' (1.27mm)
Tin
160.0µin (4.06µm)
Tin
8400
68 (4 x 17)
Copper Alloy
0.050' (1.27mm)
Copper Alloy
0.132' (3.35mm)
15mOhm
1 A
8468
Tape & Reel (TR)
RFQ
110-87-424-41-001101
Preci-Dip
CONN IC DIP SOCKET 24POS GOLD
В наличност43964 pcs
-
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.4' (10.16mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100' (2.54mm)
Gold
Flash
Tin
110
24 (2 x 12)
Beryllium Copper
0.100' (2.54mm)
Brass
0.125' (3.18mm)
10mOhm
1 A
110-87
Bulk
RFQ
824-AG30D-ES
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Изход
824-AG30D-ES.pdf
-
-55°C ~ 105°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
Open Frame
UL94 V-0
Polyester
0.100" (2.54mm)
Gold
25.0µin (0.63µm)
-
800
24 (2 x 12)
Copper Alloy
0.100" (2.54mm)
-
0.125" (3.18mm)
10mOhm
3 A
824
Tube
RFQ
116-87-210-41-013101
Preci-Dip
CONN IC DIP SOCKET 10POS GOLD
В наличност48478 pcs
-
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.2" (5.08mm) Row Spacing
Elevated, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100" (2.54mm)
Gold
Flash
Tin
116
10 (2 x 5)
Beryllium Copper
0.100" (2.54mm)
Brass
0.125" (3.18mm)
10mOhm
1 A
116-87
Bulk
RFQ
1-390261-5
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS TIN
Изход
1-390261-5.pdf
60.0µin (1.52µm)
-40°C ~ 105°C
Through Hole
Solder
DIP, 0.3' (7.62mm) Row Spacing
Open Frame
-
-
0.100' (2.54mm)
Tin
60.0µin (1.52µm)
Tin
-
18 (2 x 9)
Phosphor Bronze
0.100' (2.54mm)
Phosphor Bronze
0.118' (3.00mm)
30mOhm
-
390261
Tube
RFQ
211-1-24-006
CNC Tech
CONN IC DIP SOCKET 24POS GOLD
В наличност46807 pcs
211-1-24-006.pdf
200.0µin (5.08µm)
-55°C ~ 105°C
Through Hole
Solder
DIP, 0.6" (15.24mm) Row Spacing
Open Frame
UL94 V-0
Polybutylene Terephthalate (PBT)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin
-
24 (2 x 12)
Beryllium Copper
0.100" (2.54mm)
Brass
0.110" (2.78mm)
4mOhm
3 A
211-1
Tube
RFQ
832-AG11D-ESL-LF
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS GOLD
Изход
832-AG11D-ESL-LF.pdf
-
-55°C ~ 105°C
Through Hole
Solder
DIP, 0.6' (15.24mm) Row Spacing
Open Frame
UL94 V-0
Polyester
0.100' (2.54mm)
Gold
Flash
Tin-Lead
800
32 (2 x 16)
Copper Alloy
0.100' (2.54mm)
Copper Alloy
0.125' (3.18mm)
10mOhm
3 A
832
Tube
RFQ
110-87-428-41-001101
Preci-Dip
CONN IC DIP SOCKET 28POS GOLD
В наличност29793 pcs
-
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.4' (10.16mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100' (2.54mm)
Gold
Flash
Tin
110
28 (2 x 14)
Beryllium Copper
0.100' (2.54mm)
Brass
0.125' (3.18mm)
10mOhm
1 A
110-87
Bulk
RFQ
614-41-210-41-001000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
В наличност29308 pcs
614-41-210-41-001000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.2" (5.08mm) Row Spacing
Carrier, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin
614
10 (2 x 5)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.165" (4.19mm)
10mOhm
3 A
614-41
Tube
RFQ
551-10-361-19-000005
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
Изход
551-10-361-19-000005.pdf
10.0µin (0.25µm)
-
Through Hole
Solder
PGA
-
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Gold
551
361 (19 x 19)
-
0.100" (2.54mm)
Brass Alloy
0.154" (3.91mm)
-
-
551-10
Bulk
RFQ
116-93-324-61-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
В наличност36582 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
Elevated, Open Frame
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
116
24 (2 x 12)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
-
3 A
116-93
Tube
RFQ
111-91-420-41-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
В наличност39714 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.4" (10.16mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
111
20 (2 x 10)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.170" (4.32mm)
10mOhm
3 A
111-91
Tube
RFQ
523-13-209-17-081002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
Изход
523-13-209-17-081002.pdf
10.0µin (0.25µm)
-
Through Hole
Wire Wrap
PGA
-
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
523
209 (17 x 17)
-
0.100" (2.54mm)
-
0.510" (12.95mm)
-
-
523-13
Bulk
RFQ
511-13-084-11-041003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Изход
511-13-084-11-041003.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
511
84 (11 x 11)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.170" (4.32mm)
10mOhm
3 A
511-13
Bulk
RFQ
110-87-310-41-105191
Preci-Dip
CONN IC DIP SOCKET 10POS GOLD
В наличност39195 pcs
-
-55°C ~ 125°C
Surface Mount
Solder
DIP, 0.3" (7.62mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100" (2.54mm)
Gold
Flash
Tin
110
10 (2 x 5)
Beryllium Copper
0.100" (2.54mm)
Brass
0.118" (3.00mm)
10mOhm
1 A
110-87
Bulk
RFQ
518-77-504M29-001106
Preci-Dip
CONN SOCKET PGA 504POS GOLD
В наличност30352 pcs
Flash
-55°C ~ 125°C
Surface Mount
Solder
PGA
Open Frame
UL94 V-0
FR4 Epoxy Glass
0.050' (1.27mm)
Gold
Flash
Gold
518
504 (29 x 29)
Beryllium Copper
0.050' (1.27mm)
Brass
0.062' (1.57mm)
10mOhm
1 A
518-77
Bulk
RFQ
515-91-159-16-105003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Изход
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
515
159 (16 x 16)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
10mOhm
3 A
515-91
Bulk
RFQ
612-93-640-41-001000
Mill-Max Manufacturing Corp.
SOCKET CARRIER SLDRTL .600 40POS
В наличност45864 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.6" (15.24mm) Row Spacing
Carrier, Open Frame
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
-
40 (2 x 20)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
-
-
-
-
-
RFQ
12-6513-10H
Aries Electronics
CONN IC DIP SOCKET 12POS GOLD
В наличност31576 pcs
12-6513-10H.pdf
200.0µin (5.08µm)
-55°C ~ 105°C
Through Hole
Solder
DIP, 0.6" (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin
Lo-PRO®file, 513
12 (2 x 6)
Beryllium Copper
0.100" (2.54mm)
Brass
0.125" (3.18mm)
-
3 A
12-6513
Bulk
RFQ
110-93-328-61-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
В наличност38271 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
-
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
110
28 (2 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
110-93
Tube
RFQ
510-13-022-05-001001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
В наличност39271 pcs
510-13-022-05-001001.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
510
22 (5 x 5)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
510-13
Bulk
RFQ
614-93-324-31-002000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
В наличност48430 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
Carrier, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
614
24 (2 x 12)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.136" (3.45mm)
10mOhm
3 A
614-93
Tube
RFQ
510-93-125-14-071001
Mill-Max Manufacturing Corp.
SOCKET SOLDERTAIL 125-PGA
В наличност28376 pcs
-
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
-
-
125 (14 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
-
-
-
-
-
RFQ
523-13-108-12-051001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
Изход
523-13-108-12-051001.pdf
10.0µin (0.25µm)
-
Through Hole
Wire Wrap
PGA
-
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
523
108 (12 x 12)
-
0.100" (2.54mm)
-
0.510" (12.95mm)
-
-
523-13
Bulk
RFQ
36-6572-16
Aries Electronics
CONN IC DIP SOCKET ZIF 36POS TIN
В наличност46493 pcs
36-6572-16.pdf
200.0µin (5.08µm)
-
Through Hole
Solder
DIP, ZIF (ZIP), 0.6' (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyphenylene Sulfide (PPS), Glass Filled
0.100' (2.54mm)
Tin
200.0µin (5.08µm)
Tin
57
36 (2 x 18)
Beryllium Copper
0.100' (2.54mm)
Beryllium Copper
0.110' (2.78mm)
-
1 A
36-6572
Bulk
RFQ
14-7350-10
Aries Electronics
CONN SOCKET SIP 14POS TIN
В наличност43002 pcs
14-7350-10.pdf
200.0µin (5.08µm)
-55°C ~ 105°C
Through Hole
Solder
SIP
Elevated
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Tin
200.0µin (5.08µm)
Tin
700 Elevator Strip-Line™
14 (1 x 14)
Phosphor Bronze
0.100' (2.54mm)
Phosphor Bronze
0.150' (3.81mm)
-
1.5 A
14-7350
Bulk
RFQ
515-93-069-11-061003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Изход
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
515
69 (11 x 11)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
10mOhm
3 A
515-93
Bulk
RFQ
116-43-420-61-006000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
В наличност43872 pcs
116-43-420-61-006000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.4" (10.16mm) Row Spacing
Elevated, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin
116
20 (2 x 10)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.236" (5.99mm)
10mOhm
3 A
116-43
Tube
RFQ
13-0503-20
Aries Electronics
CONN SOCKET SIP 13POS GOLD
В наличност34955 pcs
13-0503-20.pdf
200.0µin (5.08µm)
-
Through Hole
Wire Wrap
SIP
-
UL94 HB
Polyamide (PA), Nylon, Glass Filled
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin
0503
13 (1 x 13)
Beryllium Copper
0.100" (2.54mm)
Brass
0.360" (9.14mm)
-
3 A
13-0503
Bulk
RFQ
522-13-036-06-000003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
Изход
522-13-036-06-000003.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
PGA
Closed Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
522
36 (6 x 6)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.370" (9.40mm)
10mOhm
3 A
522-13
Bulk
RFQ
515-91-064-10-051002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Изход
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
515
64 (10 x 10)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
10mOhm
3 A
515-91
Bulk
RFQ
510-13-125-14-071003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
В наличност36380 pcs
510-13-125-14-071003.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
510
125 (14 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
510-13
Bulk
RFQ
APA-648-T-B
Samtec Inc.
ADAPTER PLUG
Изход
-
-
Through Hole
Solder
-
Open Frame
UL94 V-0
Polybutylene Terephthalate (PBT), Glass Filled
0.100" (2.54mm)
Tin
-
Tin
APA
48 (2 x 24)
Phosphor Bronze
0.100" (2.54mm)
Phosphor Bronze
-
-
-
APA-648
Bulk
RFQ
614-87-642-41-001101
Preci-Dip
CONN IC DIP SOCKET 42POS GOLD
В наличност48787 pcs
-
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.6' (15.24mm) Row Spacing
Carrier, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100' (2.54mm)
Gold
Flash
Tin
614
42 (2 x 21)
Beryllium Copper
0.100' (2.54mm)
Brass
0.136' (3.45mm)
10mOhm
1 A
614-87
Bulk
RFQ
34-6501-30
Aries Electronics
CONN IC DIP SOCKET 34POS TIN
В наличност47440 pcs
34-6501-30.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
DIP, 0.6' (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Tin
200.0µin (5.08µm)
Tin
501
34 (2 x 17)
Phosphor Bronze
0.100' (2.54mm)
Phosphor Bronze
0.690' (17.52mm)
-
1.5 A
34-6501
Bulk
RFQ
511-13-168-17-101001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Изход
511-13-168-17-101001.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
511
168 (17 x 17)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.170" (4.32mm)
10mOhm
3 A
511-13
Bulk
RFQ
APA-308-T-K
Samtec Inc.
ADAPTER PLUG
Изход
-
-
Through Hole
Solder
-
Open Frame
UL94 V-0
Polybutylene Terephthalate (PBT), Glass Filled
0.100" (2.54mm)
Tin
-
Tin
APA
8 (2 x 4)
Phosphor Bronze
0.100" (2.54mm)
Phosphor Bronze
-
-
-
APA-308
Bulk
RFQ
20-7570-10
Aries Electronics
CONN SOCKET SIP 20POS TIN
В наличност42053 pcs
20-7570-10.pdf
200.0µin (5.08µm)
-55°C ~ 105°C
Through Hole
Solder
SIP
Elevated
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Tin
200.0µin (5.08µm)
Tin
700 Elevator Strip-Line™
20 (1 x 20)
Phosphor Bronze
0.100' (2.54mm)
Phosphor Bronze
0.150' (3.81mm)
-
1.5 A
20-7570
Bulk
RFQ
511-93-125-13-041001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Изход
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
511
125 (13 x 13)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.170" (4.32mm)
10mOhm
3 A
511-93
Bulk
RFQ
104-11-642-41-770000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
В наличност47619 pcs
104-11-642-41-770000.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Gold
104
42 (2 x 21)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.175" (4.45mm)
10mOhm
3 A
104-11
Tube
RFQ
510-93-028-06-005002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
В наличност29933 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
510
28 (6 x 6)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
510-93
Bulk
RFQ
4-1437504-5
TE Connectivity AMP Connectors
CONN TRANSIST TO-3 3POS GOLD
Изход
4-1437504-5.pdf
30.0µin (0.76µm)
-55°C ~ 125°C
Chassis Mount
Solder
Transistor, TO-3
Closed Frame
-
Polytetrafluoroethylene (PTFE)
-
Gold
30.0µin (0.76µm)
Gold
8060
3 (Oval)
Beryllium Copper
-
Beryllium Copper
-
-
-
1437504
Bulk
RFQ
511-91-124-14-071002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Изход
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
511
124 (14 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.170" (4.32mm)
10mOhm
3 A
511-91
Bulk
RFQ
522-13-068-10-041002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
Изход
522-13-068-10-041002.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
522
68 (10 x 10)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.370" (9.40mm)
10mOhm
3 A
522-13
Bulk
RFQ
124-91-322-41-002000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
В наличност46674 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
DIP, 0.3" (7.62mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
124
22 (2 x 11)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.630" (16.00mm)
10mOhm
3 A
124-91
Tube
RFQ
38-0518-00
Aries Electronics
CONN SOCKET SIP 38POS GOLD
В наличност29226 pcs
38-0518-00.pdf
200.0µin (5.08µm)
-
Surface Mount
Solder
SIP
Open Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Gold
10.0µin (0.25µm)
Tin
518
38 (1 x 38)
Beryllium Copper
0.100' (2.54mm)
Brass
0.046' (1.17mm)
-
3 A
38-0518
Bulk
RFQ
126-93-420-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
В наличност42513 pcs
126-93-420-41-001000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
DIP, 0.4" (10.16mm) Row Spacing
Open Frame
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
126
20 (2 x 10)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.232" (5.89mm)
-
3 A
126-93
Tube
RFQ
115-43-636-41-003000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
В наличност39709 pcs
115-43-636-41-003000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.6" (15.24mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin
115
36 (2 x 18)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.095" (2.41mm)
10mOhm
3 A
115-43
Tube
RFQ